Lead Surface Mount Technology Engineer (RICHARDSON)

Job Summary

The SMT Principal Engineer I at Jabil, Inc. is a senior technical contributor responsible for leading advanced surface mount technology (SMT) process development, optimization, and continuous improvement initiatives across multiple manufacturing lines to ensure high-quality and efficient production of complex electronic assemblies.

Job Responsibilities

- Lead the development, implementation, and optimization of SMT processes, including paste printing, pick-and-place FUJI, reflow soldering, and post-reflow inspection (AOI, X-ray).

- Conduct in-depth analysis of SMT process data, identifying root causes of defects and implementing effective corrective and preventive actions.

- Develop and qualify new SMT equipment, materials, and processes, ensuring seamless integration into existing production environments.

- Provide expert technical guidance and mentorship to junior engineers and production teams on SMT best practices, troubleshooting, and process control.

- Collaborate with design engineering, supply chain, and quality departments to ensure manufacturability (DFM) of new products and resolve SMT-related design issues.

- Drive continuous improvement projects utilizing methodologies such as Six Sigma, Lean Manufacturing, and SPC to enhance SMT yield, throughput, and reliability.

- Author and maintain comprehensive SMT process documentation, including work instructions, process specifications, and failure analysis reports.

- Evaluate and implement new SMT technologies and industry trends to maintain Jabil's competitive edge and address evolving product requirements.

- Lead efforts in root cause analysis for complex SMT failures, implementing robust solutions to prevent recurrence.

- Represent Jabil in technical discussions with customers and suppliers regarding SMT process capabilities and new product introductions.

Job Qualifications

- Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical field. Master's degree preferred.

- 8-12 years of progressive experience in SMT process engineering within a high-volume electronics manufacturing environment.

- Strong Knowledge of FUJI Setup, Nexim and Valor

- Demonstrated expertise in SMT equipment operation, programming, and maintenance, including printers, pick-and-place machines (e.g., Fuji, Programming, etc.), reflow ovens, and inspection systems (AOI, SPI, X-ray).

- In-depth knowledge of various soldering technologies, solder paste chemistries, and component packaging.

- Proven track record of leading process improvement projects and achieving significant yield and cost reductions.

- Strong analytical and problem-solving skills with a data-driven approach to decision-making (e.g., SPC, DOE).

- Excellent communication, interpersonal, and presentation skills, with the ability to effectively collaborate with cross-functional teams and external stakeholders.

- Proficiency in statistical analysis software (e.g., Minitab, JMP) and CAD software for DFM analysis.

- Familiarity with industry standards such as IPC-A-610 and J-STD-001.

- Ability to work independently and manage multiple complex projects simultaneously.