Manufacturing Process Engineer

Qualifications

• Bachelor’s in Engineering (or related field) with 2–5 years in electronics/electromechanical manufacturing, mechanical design, or RF/Microwave component assembly; experience in semiconductor assembly and packaging.
• Knowledge of assembly processes (surface mount, high-frequency, die/wire attach, encapsulation), PCB technologies, plating, adhesives, solder materials; proficiency in AutoCAD, SolidWorks, and Microsoft Office.
• Strong understanding of statistical process control, problem-solving methods, and mechanical reliability testing.
• Self-starter with curiosity and initiative; strong team player in cross-functional environments; excellent communication, critical thinking, and organizational skills.
• Ability to manage multiple projects, meet deadlines, and deliver results; proven creativity and innovation; familiarity with department database tools (e.g., A/S400, Arena).

Responsibilities

• Production Setup & Optimization
• Establish new production lines and improve existing ones.
• Evaluate and qualify equipment for manufacturing processes.
• Optimize layout for space and equipment utilization.
• Process & Quality Improvement
• Apply lean principles, ergonomics, time studies, and procedural analysis.
• Drive safety, quality, and productivity improvements.
• Identify cost reduction and waste elimination opportunities.
• Cross-Functional Collaboration
• Partner with other departments for output improvements.
• Lead design reviews and NPI (New Product Introduction) assessments.
• Facilitate root cause analysis (RCA) and corrective actions.
• Documentation & Compliance
• Review qualification plans and ensure ECNs (Engineering Change Notices).
• Maintain and revise control plans (CPs).
• Prepare KPI reports and leadership presentations.
• Innovation & Standards
• Stay current on industry trends and best practices.
• Implement automation and mechanization where possible.
• Use design of experiments (DOE) for problem-solving.